Publication:

Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits

Date

2023
Journal article
https://doi.org/10.1109/tcad.2022.3216549
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Published version 7.19 MB
Accepted version 3.6 MB

Author(s)

Coenen, David  
;
Oprins, Herman  
;
Degraeve, Robin  
;
De Wolf, Ingrid  

Journal

IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS

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723 since deposited on 2023-08-04
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1150 since deposited on 2023-08-04
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