Publication:

3D Si-level integration in wireless sensor node

Date

2009

Proceedings Paper

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Files

19954.pdf 858.02 KB

Author(s)

van Engen, Piet

;

van Doremalen, Ric

;

Jochems, Wouter

;

;

;

Rydberg, Anders

;

Fritzsch, Thomas

;

;

De Raedt, Walter

;

Muller, Philippe

;

Alarcon, Eduardo

;

Sanduleanu, Mihai

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2040 since deposited on 2021-10-18

Acq. date: 2026-06-05