Publication:

Direct etched Cu characterization for advanced interconnects

Date

2015

Proceedings Paper

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31423.pdf 673.52 KB

Author(s)

Wen, Liang Gong

;

Yamashita, Fumiko

;

;

;

Tahara, Shigeru

;

Shimoda, Keiichi

;

Maeshiro, Takeru

;

Nishimura, Eiichi

;

Lazzarino, Frederic

;

;

Boemmels, Juergen

;

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Acq. date: 2026-08-15