Publication:
Demonstration of ultra-thin Si grinding process controlled by in-situ non-contact gauge for 3D stacked IC (3D-SIC)
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2292 since deposited on 2021-10-19
2last month
Acq. date: 2026-06-03
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Statistics
Views
2292 since deposited on 2021-10-19
2last month
Acq. date: 2026-06-03
Citations