Publication:
Engineering self assembled monolayer as copper diffusion barrier: Cu/NH2-SAM/SiO2 interface characterization
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1853 since deposited on 2021-10-17
1last month
Acq. date: 2026-08-23
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Statistics
Views
1853 since deposited on 2021-10-17
1last month
Acq. date: 2026-08-23
Citations