Publication:

3D chip package interaction thermo-mechanical challenges: proximity effects of through silicon vias and μ-bumps

Date

2012
Proceedings Paper
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Author(s)

Guo, Wei  
;
Van der Plas, Geert  
;
Ivankovic, Andrej
;
Eneman, Geert  
;
Cherman, Vladimir  
;
De Wachter, Bart  
;
Mercha, Abdelkarim  
;
Gonzalez, Mario  
;
Civale, Yann
;
Redolfi, Augusto  
;
Buisson, Thibault
;
Jourdain, Anne  
;
Vandevelde, Bart  
;
Rebibis, Kenneth June  
;
De Wolf, Ingrid  
;
La Manna, Antonio  
;
Beyer, Gerald  
;
Beyne, Eric  
;
Swinnen, Bart  

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