Publication:

Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers

Date

2024
Proceedings Paper
https://doi.org/10.1109/ectc51529.2024.00069
Simple item page Full metadata Statistics
Loading...
Thumbnail Image

Author(s)

Kang, Shuo  
;
Iacovo, Serena  
;
D'have, Koen  
;
Van Huylenbroeck, Stefaan  
;
Okudur, Oguzhan Orkut  
;
Alexeev, Anton
;
Plach, Thomas
;
Probst, Gernot
;
Ding, Taotao
;
Wimplinger, Markus
;
Uhrmann, Thomas
;
De Vos, Joeri  
;
Beyer, Gerald  
;
Beyne, Eric  

Journal

N/A

Abstract

Description

Statistics

Views

331 since deposited on 2024-12-07
7last month
1last week
Acq. date: 2026-08-19

Citations

Statistics

Views

331 since deposited on 2024-12-07
7last month
1last week
Acq. date: 2026-08-19

Citations