Publication:

Characterisation, modelling and design of bond-wire interconnects for chip-package co-design

Date

2003

Proceedings Paper

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Author(s)

Chandrasekhar, Arun

;

Stoukatch, Serguei

;

Brebels, Steven

;

Balachandran, Jayaprakash

;

;

De Raedt, Walter

;

Nauwelaers, Bart

;

Podddar, Anindya

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1943 since deposited on 2021-10-15

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Acq. date: 2026-05-29