Publication:
SLIM-Cut: a kerf-loss-free method for wafering 50-μm-thick crystalline Si wafers based on stress-induced lift-off
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1906 since deposited on 2021-10-17
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Acq. date: 2026-10-13
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Statistics
Views
1906 since deposited on 2021-10-17
3last month
3last week
Acq. date: 2026-10-13
Citations