Publication:
SLIM-Cut: a kerf-loss-free method for wafering 50-μm-thick crystalline Si wafers based on stress-induced lift-off
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1903 since deposited on 2021-10-17
6last month
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Acq. date: 2026-08-19
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Statistics
Views
1903 since deposited on 2021-10-17
6last month
1last week
Acq. date: 2026-08-19
Citations