Publication:

Simulation of Cu pad expansion in wafer-to-wafer Cu/SiCN hybrid bonding

Date

2022

Journal article

https://doi.org/10.1016/j.microrel.2022.114716

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Author(s)

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De Messemaeker, Joke

;

Salahouelhadj, Abdellah

;

Gonzalez, Mario

;

Witters, Liesbeth

;

;

;

;

De Wolf, Ingrid

Journal

MICROELECTRONICS RELIABILITY

Statistics

1435 since deposited on 2023-01-09

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Acq. date: 2026-05-31