Publication:
Parylene-C for hermetic and flexible encapsulation of interconnects and electronic components
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Acq. date: 2026-06-04
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Acq. date: 2026-06-04
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1 since deposited on 2021-10-21
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1981 since deposited on 2021-10-21
2last month
Acq. date: 2026-06-04
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