Publication:
20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nanoparticles sintering
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248 since deposited on 2024-12-07
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Acq. date: 2026-10-13
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Statistics
Views
248 since deposited on 2024-12-07
2last month
2last week
Acq. date: 2026-10-13
Citations