Publication:
Analysis of the induced stresses in silicon during thermocompression Cu-Cu bonding of Cu-through-vias in 3D-SIC architecture
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1944 since deposited on 2021-10-16
2last month
Acq. date: 2026-05-31
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Statistics
Views
1944 since deposited on 2021-10-16
2last month
Acq. date: 2026-05-31
Citations