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A Current-Mode Nondestructive Circuit Readout Scheme for High-Density 3-D Ferroelectric Memory

 
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dc.contributor.authorWang, Chaohan
dc.contributor.authorHussein, Wagdy
dc.contributor.authorXiang, Yang
dc.contributor.authorMukherjee, Shankha
dc.contributor.authorCevik, Ismail
dc.contributor.authorGarcia Redondo, Fernando
dc.contributor.authorSpagnolo, Annachiara
dc.contributor.authorOh, Hyungrock
dc.contributor.authorGarcia Bardon, Marie
dc.contributor.authorVan Helleputte, Nick
dc.contributor.authorRyckaert, Julien
dc.contributor.authorHellings, Geert
dc.contributor.authorBiswas, Dwaipayan
dc.contributor.authorVan Houdt, Jan
dc.date.accessioned2026-09-28T09:36:33Z
dc.date.available2026-09-28T09:36:33Z
dc.date.createdwos2026
dc.date.issued2026
dc.description.abstractThe AI era is demanding ever-increasing memory capacity and bandwidth, where 3-D-stacked ferroelectric memory (FeRAM) utilizing nondestructive readout (NDRO) ferroelectric capacitors (FeCAPs) stand as a promising candidate. This work addresses NDRO sensing signal challenges in deeply scaled 3-D FeRAMs using a current-mode sensing scheme, co-designed with the device architecture to overcome signal degradation due to capacitive charge sharing. By exploring gm cell design and time-differential bipolar readout, we demonstrate the feasibility of 3-D stacking up to 128 FeCAPs while maintaining sub- μs access, transcending the conventional charge-sharing-defined stacking limit of 64 and achieving an effective bit density of ∼200 Mb/mm2 . Using a two-stage Miller-compensated high-GBW operational transconductance amplifier (OTA) implementation, we additionally underscore the robustness of our sensing scheme against variability in CMOS circuits, but also in bit-cell FeCAPs, such as FeCAP area variation (~80%), memory window fluctuation (~15 aF), and work function asymmetry (~200 mV). The proposed architecture further provides a flexible design tradeoff between read speed and energy consumption, where a single-stage low-power OTA design allows read energy scaling down to ~10 pJ/bit at μs -level access time. The FeCAP model is calibrated to experimental data, ensuring realistic simulation fidelity. These results offer instrumental insights into the design-technology co-optimization (DTCO) of 3-D FeRAM-based storage-class memories (SCMs).
dc.description.wosFundingTextThis work was supported by the Imec's Industry Affiliation Program (IIAP).
dc.identifier.doi10.1109/jxcdc.2026.3727137
dc.identifier.issn2329-9231
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/60500
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage199
dc.source.endpage204
dc.source.journalIEEE JOURNAL ON EXPLORATORY SOLID-STATE COMPUTATIONAL DEVICES AND CIRCUITS
dc.source.numberofpages6
dc.source.volume12
dc.title

A Current-Mode Nondestructive Circuit Readout Scheme for High-Density 3-D Ferroelectric Memory

dc.typeJournal article
dspace.entity.typePublication
imec.internal.crawledAt2026-08-27
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-09-22
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