Publication:

Creating 1 $lm RDL structures for fan-out wafer-level packaging

Date

2018

Journal article

Simple item page Full metadata Statistics

Files

38877.pdf 5.65 MB

Author(s)

;

Slabbekoorn, John

Journal

Chip Scale Review

Statistics

1962 since deposited on 2021-10-25

4last month

Acq. date: 2026-10-12