Publication:

Cu-Cu insertion bonding technique using photosensitive polymer as WLUF

Date

2014

Proceedings Paper

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Author(s)

Potoms, Goedele

;

;

Derakhshandeh, Jaber

;

;

Capuz, Giovanni

;

Gonzalez, Mario

;

;

Rebibis, Kenneth June

;

;

Statistics

1968 since deposited on 2021-10-22

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Acq. date: 2026-08-17