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Hybrid Channel monolithic-CFET with Si (110) pMOS and (100) nMOS

 
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dc.contributor.authorVandooren, Anne
dc.contributor.authorIacovo, Serena
dc.contributor.authorBrissonneau, Vincent
dc.contributor.authorChiarella, Thomas
dc.contributor.authorCullen, C.
dc.contributor.authorCasey, D.
dc.contributor.authorRengo, G.
dc.contributor.authorKhazaka, R.
dc.contributor.authorEyben, Pierre
dc.contributor.authorChannam, Venkat Sunil Kumar
dc.contributor.authorGanguly, Jishnu
dc.contributor.authorStiers, Karen
dc.contributor.authorSheng, Cassie
dc.contributor.authorToledo de Carvalho Cavalcante, Camila
dc.contributor.authorHosseini, Maryam
dc.contributor.authorBatuk, Dmitry
dc.contributor.authorPeng, A.
dc.contributor.authorZhou, X.
dc.contributor.authorSarkar, Ritam
dc.contributor.authorVeloso, Anabela
dc.date.accessioned2026-08-21T08:56:44Z
dc.date.available2026-08-21T08:56:44Z
dc.date.createdwos2026
dc.date.issued2025
dc.description.abstractThis work reports on the demonstration of a monolithic-CFET (mCFET) integrating different channels for nMOS and pMOS. We enhanced our conventional mCFET process with a (110) Si pMOS - (100) Si nMOS combination and a single film embedded middle dielectric insulator (eMDI) by means of layer transfer. Using this advanced substrate, these two new features can be integrated in any mCFET baseline with minimal modifications and reduced process complexity compared to a replacement MDI (rMDI) integration. Functional PMOS and NMOS devices featuring SiCN eMDI are reported. Key aspects related to the bonding dielectric interface and the C content in SiCN MDI are assessed.
dc.description.wosFundingTextThis research was funded by imec's Core Partner Program and EU projects. This work has been enabled in part by the NanoIC pilot line. The acquisition and operation are jointly funded by the Chips Joint Undertaking, through the European Union's Digital Europe (101183266) and Horizon Europe programs (101183277), as well as by the participating states Belgium (Flanders), France, Germany, Finland, Ireland and Romania.
dc.identifier.doi10.1109/iedm50572.2025.11353866
dc.identifier.isbn979-8-3315-6786-6
dc.identifier.issn2380-9248
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/60084
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE
dc.source.conferenceIEEE International Electron Devices Meeting (IEDM)
dc.source.conferencedate2025-12-06
dc.source.conferencelocationSan Francisco
dc.source.journal2025 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, IEDM
dc.source.numberofpages4
dc.title

Hybrid Channel monolithic-CFET with Si (110) pMOS and (100) nMOS

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2026-07-14
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-07-14
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