Publication:

Challenges of large area integration of 2D materials in CMOS line

Date

2018
Meeting abstract
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Author(s)

Huyghebaert, Cedric  
;
Schram, Tom  
;
Smets, Quentin  
;
Chiappe, Daniele
;
Asselberghs, Inge  
;
Brems, Steven  
;
Verguts, Ken
;
Marinov, Daniil
;
Pantouvaki, Marianna  

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