Publication:

Die to wafer 3D stacking for below 10μm pitch microbumps

Date

2016
Proceedings Paper
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Author(s)

Derakhshandeh, Jaber  
;
Hou, Lin  
;
De Preter, Inge  
;
Gerets, Carine  
;
Suhard, Samuel  
;
Dubey, Vikas
;
Jamieson, Geraldine  
;
Inoue, Fumihiro  
;
Webers, Tomas  
;
Bex, Pieter  
;
Capuz, Giovanni  
;
Beyne, Eric  
;
Slabbekoorn, John  
;
Wang, Teng
;
Jourdain, Anne  
;
Beyer, Gerald  
;
Rebibis, Kenneth June  
;
Miller, Andy  

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