Publication:
High quality NH2SAM (Self Assembled Monolayer) diffusion barrier for advanced copper interconnects
Date
Loading...
Journal
Abstract
Description
Statistics
Views
1906 since deposited on 2021-10-18
Acq. date: 2026-06-02
Citations
Statistics
Views
1906 since deposited on 2021-10-18
Acq. date: 2026-06-02
Citations