Solving the Annealing of Mo Interconnects for Next-Gen Integrated Circuits

Erofeev, Ivan; Hartanto, Antony Winata; Saidov, Khakimjon; Aabdin, Zainul; Pacco, Antoine; Philipsen, Harold; Tjiu, Weng Weei; Hui, Hui Kim; Holsteyns, Frank; Mirsaidov, Utkur

doi:10.1002/aelm.202400035

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Solving the Annealing of Mo Interconnects for Next-Gen Integrated Circuits

Date

2024

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https://doi.org/10.1002/aelm.202400035

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Erofeev, Ivan

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Hartanto, Antony Winata

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ADVANCED ELECTRONIC MATERIALS

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Acq. date: 2026-08-14

657 since deposited on 2024-07-04

Acq. date: 2026-08-14

Solving the Annealing of Mo Interconnects for Next-Gen Integrated Circuits

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