Publication:

New Cu "Bulge-Out" Mechanism Supporting Sub Micron Scaling of Hybrid Wafer-to- Wafer Bonding

Date

2023

Proceedings Paper

https://doi.org/10.1109/ectc51909.2023.00027

Simple item page Full metadata Statistics

Author(s)

De Messemaeker, Joke

;

Witters, Liesbeth

;

;

;

;

;

;

;

Journal

N/A

Statistics

956 since deposited on 2023-10-24

28last month

4last week

Acq. date: 2026-10-12