Publication:

Direct Bonding Using Low Temperature SiCN Dielectrics

Date

2022
Proceedings Paper
https://doi.org/10.1109/ectc51906.2022.00101
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Author(s)

Iacovo, Serena  
;
Nagano, Fuya  
;
Channam, Venkat Sunil Kumar  
;
Walsby, Edward
;
Crook, Kath
;
Buchanan, Keith
;
Jourdain, Anne  
;
Vanstreels, Kris  
;
Phommahaxay, Alain  
;
Beyne, Eric  

Journal

na

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1389 since deposited on 2022-09-17
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1389 since deposited on 2022-09-17
2last month
Acq. date: 2026-08-18

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