Publication:

3D IC process development for enabling chip-on-chip and chip on wafer multi-stacking at assembly

Date

2015

Meeting abstract

Simple item page Full metadata Statistics

Files

30880.pdf 13.22 MB

Author(s)

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Capuz, Giovanni

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Struyf, Herbert

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Demeurisse, Caroline

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Statistics

2006 since deposited on 2021-10-22

Acq. date: 2026-05-31