2025 INTERNATIONAL VLSI SYMPOSIUM ON TECHNOLOGY, SYSTEMS AND APPLICATIONS, VLSI TSA
Abstract
We present our efforts to facilitate 300mm MX2 growth on sapphire and completely automate the layer transfer module. Two concepts are presented; a collective die-to wafer approach (CoD2W), and a 300mm wafer-to-wafer approach (W2W), both with the vision of enabling MX2 integration in foundries for BEOL and/or FEOL applications.
