Publication:

A MEMS 0-level packaging technology based on CuSn/Cu chip capping bonding

Date

2011

Proceedings Paper

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Author(s)

Bogaerts, Lieve

;

Phommahaxay, Alain

;

Rottenberg, Xavier

;

;

De Coster, Jeroen

;

Varela Pedreira, Olalla

;

Van Hoovels, Nele

;

Cherman, Vladimir

;

Helin, Philippe

;

;

Tilmans, Harrie

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Acq. date: 2026-08-20