Publication:
Thermal fatigue analysis of the FLIP CHIP assembly on the POLYMER STUD GRID ARRAY (PSGA(tm)) package
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1924 since deposited on 2021-10-14
1last month
Acq. date: 2026-05-31
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Views
1924 since deposited on 2021-10-14
1last month
Acq. date: 2026-05-31
Citations