Publication:

Thermal stability of copper through-silicon via barriers during IC processing

Date

2011
Proceedings Paper
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Author(s)

Civale, Yann
;
Croes, Kristof  
;
Miyamori, Yuichi
;
Thangaraju, Sarasvathi
;
Redolfi, Augusto  
;
Van Ammel, Annemie  
;
Velenis, Dimitrios  
;
Cherman, Vladimir  
;
Hendrickx, Paul  
;
Van der Plas, Geert  
;
Cockburn, Andrew  
;
Gravey, Virginie
;
Kumar, Nirajan
;
Zhitao, Cao
;
Sabuncuoglu Tezcan, Deniz  
;
Soussan, Philippe  
;
Travaly, Youssef
;
Tokei, Zsolt  
;
Beyne, Eric  
;
Swinnen, Bart  

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1902 since deposited on 2021-10-19
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