Publication:

First demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP

Date

2022-06-15
Proceedings Paper
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Accepted version 364.15 KB

Author(s)

Murdoch, Gayle  
;
O'Toole, Martin  
;
Marti, Giulio  
;
Pokhrel, Ankit  
;
Tsvetanova, Diana  
;
Decoster, Stefan  
;
Kundu, Souvik  
;
Oniki, Yusuke  
;
Thiam, Arame  
;
Le, Quoc Toan  
;
Varela Pedreira, Olalla  
;
Lesniewska, Alicja  
;
Martinez Alanis, Gerardo Tadeo  
;
Park, Seongho  
;
Tokei, Zsolt  

Journal

2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)

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2819 since deposited on 2023-06-26
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