Publication:
Characterization of silicon carbon nitride for low temperature wafer-to-wafer direct bonding
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1988 since deposited on 2021-10-29
9last month
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Acq. date: 2026-08-20
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Statistics
Views
1988 since deposited on 2021-10-29
9last month
1last week
Acq. date: 2026-08-20
Citations