Publication:

Vapor deposited thin organic-inorganic capping layers preventing copper line oxidation in polymer-based RDL technologies

Date

2022
Journal article
https://doi.org/10.1016/j.mee.2022.111896
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Accepted version 5.36 MB

Author(s)

Chery, Emmanuel  
;
Brady-Boyd, Anita  
;
Lin, Yuyuan
;
Grimes, Michael
;
Springer, David
;
Slabbekoorn, John  
;
Walsby, Edward
;
Croes, Kristof  
;
Beyne, Eric  

Journal

Microelectronic Engineering

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615 since deposited on 2022-10-21
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1605 since deposited on 2022-10-21
Acq. date: 2026-08-19

Citations