Publication:

Overlay scaling error reduction for hybrid Die-To-Wafer bonding

Date

2024

Proceedings Paper

https://doi.org/10.1109/estc60143.2024.10712020

Simple item page Full metadata Statistics

Author(s)

;

Gonzalez, Mario

;

;

Phommahaxay, Alain

;

;

Dhakras, Prathamesh

;

Cuypers, Dieter

;

;

;

Abdilla, Jonathan

;

Prince, Kawsar Ahmed

;

;

Bikaljevic, Djuro

;

Deubler, Manuel

;

;

;

Seroglazov, Pavel

Journal

N/A

Statistics

369 since deposited on 2025-02-15

48last month

3last week

Acq. date: 2026-08-20