Publication:
Reduction of plasma process induced damage during gate poly etching by using the SiO2 hard maks
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1935 since deposited on 2021-09-30
4last month
Acq. date: 2026-08-22
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Statistics
Views
1935 since deposited on 2021-09-30
4last month
Acq. date: 2026-08-22
Citations