Publication:
Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints
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988 since deposited on 2023-10-15
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Acq. date: 2026-10-12
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Statistics
Views
988 since deposited on 2023-10-15
1last month
1last week
Acq. date: 2026-10-12
Citations