Publication:
Improved resistivity of NiAl thin films at low temperature for advanced interconnect metallization
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Acq. date: 2026-10-13
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1 since deposited on 2023-04-04
Acq. date: 2026-10-13
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857 since deposited on 2023-04-04
11last month
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Acq. date: 2026-10-13
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