Publication:

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 μm

Date

2024
Proceedings Paper
https://doi.org/10.1109/ectc51529.2024.00015
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Author(s)

Lin, Ye  
;
Bex, Pieter  
;
Kennes, Koen  
;
Derakhshandeh, Jaber  
;
Dhakras, Prathamesh  
;
Suhard, Samuel  
;
Gerets, Carine  
;
Dewilde, Sven  
;
Georgieva, Violeta  
;
Jourdain, Anne  
;
Beyer, Gerald  
;
Beyne, Eric  

Journal

N/A

Abstract

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374 since deposited on 2024-12-07
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374 since deposited on 2024-12-07
20last month
5last week
Acq. date: 2026-08-22

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