Publication:

Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies and Bond Pad Pitch Scaling Down to 2 μm

Date

2024

Proceedings Paper

https://doi.org/10.1109/ECTC51529.2024.00015

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Author(s)

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Derakhshandeh, Jaber

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Dhakras, Prathamesh

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Georgieva, Violeta

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Journal

N/A

Statistics

345 since deposited on 2024-12-07

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Acq. date: 2026-06-02