Publication:
Optimising the solder joint reliability of polymer stud grid array (PSGATM) packages using thermo-mechanical analysis
Date
Loading...
Files
Journal
Abstract
Description
Statistics
Views
2009 since deposited on 2021-09-30
5last month
Acq. date: 2026-08-18
Citations
Statistics
Views
2009 since deposited on 2021-09-30
5last month
Acq. date: 2026-08-18
Citations