Publication:
Flip-chip assembly for chips with gold bumps on high density thic film substrates
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1936 since deposited on 2021-09-30
3last month
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Acq. date: 2026-08-15
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Statistics
Views
1936 since deposited on 2021-09-30
3last month
2last week
Acq. date: 2026-08-15
Citations