Publication:

A methodology for mechanical stress and wafer warpage minimization during 3D NAND fabrication

Date

2022
Journal article
https://doi.org/10.1016/j.mee.2021.111660
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Author(s)

Kruv, Anastasiia  
;
Gonzalez, Mario  
;
Okudur, Oguzhan Orkut  
;
Spampinato, Valentina  
;
Franquet, Alexis  
;
Vadakupudhu Palayam, Senthil  
;
Arreghini, Antonio  
;
Van den Bosch, Geert  
;
Rosmeulen, Maarten  
;
De Wolf, Ingrid  

Journal

MICROELECTRONIC ENGINEERING

Abstract

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1533 since deposited on 2023-06-20
15last month
6last week
Acq. date: 2026-10-13

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