Publication:

FI-CDM and LICCDM testing on wafer, single die and package levels

Date

2024
Proceedings Paper
https://doi.org/10.23919/eos/esd61719.2024.10702171
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
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cris.virtual.orcid0000-0002-0356-0973
cris.virtual.orcid0000-0002-3623-1842
cris.virtual.orcid0000-0002-6481-2951
cris.virtualsource.department5d1a73c2-f82f-43a0-9af2-32fb15f176bf
cris.virtualsource.department894d712a-328b-43e9-8331-871ceac6a4e6
cris.virtualsource.departmente0386a23-f2bf-4f53-a36f-c1380bca0db7
cris.virtualsource.orcid5d1a73c2-f82f-43a0-9af2-32fb15f176bf
cris.virtualsource.orcid894d712a-328b-43e9-8331-871ceac6a4e6
cris.virtualsource.orcide0386a23-f2bf-4f53-a36f-c1380bca0db7
dc.contributor.authorSimicic, Marko
dc.contributor.authorTakenaka, Hiroshi
dc.contributor.authorTamura, Shinichi
dc.contributor.authorClaes, Dieter
dc.contributor.authorShimada, Yohei
dc.contributor.authorSawada, Masanori
dc.contributor.authorChen, Shih-Hung
dc.contributor.imecauthorSimicic, Marko
dc.contributor.imecauthorClaes, Dieter
dc.contributor.imecauthorChen, Shih-Hung
dc.contributor.orcidimecSimicic, Marko::0000-0002-3623-1842
dc.contributor.orcidimecClaes, Dieter::0000-0002-0356-0973
dc.contributor.orcidimecChen, Shih-Hung::0000-0002-6481-2951
dc.date.accessioned2025-06-25T09:43:47Z
dc.date.available2024-12-01T23:12:00Z
dc.date.available2025-06-25T09:43:47Z
dc.date.issued2024
dc.description.abstractAlthough not mainstream yet, Contact Charged Device Model (CDM) electrostatic discharge (ESD) testers are being used by the industry. In this paper we compare the Low-Impedance Contact CDM tester to the industry standard Field-Induced CDM tester. We test an actual IC product at wafer, bare-die and package levels.
dc.identifier.doi10.23919/eos/esd61719.2024.10702171
dc.identifier.eisbn978-1-58537-353-6
dc.identifier.isbn979-8-3503-6546-7
dc.identifier.issn0739-5159
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/44882
dc.publisherIEEE
dc.source.beginpage1
dc.source.conference46th Annual Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)
dc.source.conferencedate2024
dc.source.conferencelocationReno
dc.source.journalN/A
dc.source.numberofpages7
dc.title

FI-CDM and LICCDM testing on wafer, single die and package levels

dc.typeProceedings paper
dspace.entity.typePublication
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