Publication:

Investigating Nanowire, Nanosheet and Forksheet FET Hot-Carrier Reliability via TCAD Simulations

Date

2023
Proceedings Paper
https://doi.org/10.1109/irps48203.2023.10118211
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Published version 5.11 MB
Accepted version 5.38 MB

Author(s)

Vandemaele, Michiel  
;
Kaczer, Ben  
;
Bury, Erik  
;
Franco, Jacopo  
;
Vaisman Chasin, Adrian  
;
Makarov, Alexander  
;
Mertens, Hans  
;
Hellings, Geert  
;
Groeseneken, Guido  

Journal

2023 IEEE International Reliability Physics Symposium (IRPS)

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859 since deposited on 2023-07-15
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