Publication:

Electrodeposition of Ø50 × 50 μm Cu pillars for 3D stacking applications

Date

2016
Meeting abstract
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Author(s)

El-Mekki, Zaid
;
Philipsen, Harold  
;
Honore, Mia
;
Radisic, Alex
;
Slabbekoorn, John
;
Arnold, Marco
;
Fluegel, Alexander
;
Shu-Ya Chang, Iris
;
Struyf, Herbert  
;
Mayer, Dieter

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Abstract

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1909 since deposited on 2021-10-23
Acq. date: 2026-10-12

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1909 since deposited on 2021-10-23
Acq. date: 2026-10-12

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