Publication:

An alternative 3D packaging route thru wafer reconstruction

Date

2015

Proceedings Paper

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Author(s)

Cadacio Jr., Francisco

;

;

Salahouelhadj, Abdellah

;

Capuz, Giovanni

;

;

Potoms, Goedele

;

Verwoerdt, Rudy

;

Rebibis, Kenneth June

;

;

;

;

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Acq. date: 2026-08-19