Collective die-to-wafer assembly process for optically interconnected System-on-wafer

Kennes, Koen; Dvoretskii, Anton; Podpod, Arnita; Xu, Pengfei; He, Junwen; Lepage, Guy; Golshani, Negin; Verheyen, Peter; Magdziak, Rafal; Bipul, Swetanshu; Phommahaxay, Alain; Chakrabarti, Maumita; Miller, Andy; Beyne, Eric; Ban, Yoojin; Ferraro, Filippo; van Campenhout, Joris

doi:10.1109/ectc51529.2024.00227

Publication:

Collective die-to-wafer assembly process for optically interconnected System-on-wafer

Date

2024

Proceedings Paper

https://doi.org/10.1109/ectc51529.2024.00227

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Miller, Andy

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Beyne, Eric

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Ban, Yoojin

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Ferraro, Filippo

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van Campenhout, Joris

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448 since deposited on 2024-12-07

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Acq. date: 2026-08-15

Collective die-to-wafer assembly process for optically interconnected System-on-wafer

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