Publication:
A wafer-level poly-SiGe-based thin film packaging technology demonstrated on a SOI-based high-Q MEM resonator
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1969 since deposited on 2021-10-19
3last month
Acq. date: 2026-08-16
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Statistics
Views
1969 since deposited on 2021-10-19
3last month
Acq. date: 2026-08-16
Citations