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Conference contributions
Aluminide intermetallics for advanced interconnect metallization: thin film studies
Publication:
Aluminide intermetallics for advanced interconnect metallization: thin film studies
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Date
2021
Proceedings Paper
https://doi.org/10.1109/IITC51362.2021.9537441
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2021041350_Soulie.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Soulie, Jean-Philippe
;
Tokei, Zsolt
;
Swerts, Johan
;
Adelmann, Christoph
Journal
IEEE
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Downloads
334
since deposited on 2022-05-05
23
last month
Acq. date: 2026-05-30
Views
1661
since deposited on 2022-05-05
1
last month
Acq. date: 2026-05-30
Citations