Publication:
Challenges in introducing high-density interconnect technology in printed circuit boards for space applications
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Acq. date: 2026-08-22
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Downloads
1333 since deposited on 2023-06-20
83last month
11last week
Acq. date: 2026-08-22
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1170 since deposited on 2023-06-20
1last month
Acq. date: 2026-08-22
Citations