Publication:

A combined modelling approach to design test structures to study thermomigration in Cu interconnects

Date

2022
Journal article
https://doi.org/10.1016/j.microrel.2022.114632
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Author(s)

Ding, Youqi  
;
Lofrano, Melina  
;
Varela Pedreira, Olalla  
;
Zahedmanesh, Houman  
;
Croes, Kristof  
;
De Wolf, Ingrid  

Journal

MICROELECTRONICS RELIABILITY

Abstract

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1398 since deposited on 2022-12-30
Acq. date: 2026-05-31

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1398 since deposited on 2022-12-30
Acq. date: 2026-05-31

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