Browsing by Author "Hsu, Alex"
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Publication Diffraction-Based Alignment Sensor and Mark Design Optimization to Enable Fine Overlay Accuracy for 50um-Thick Si Wafer Bonded to Glass Wafer in Die-to-Wafer Bonding Applications
; ; ; ; ; Proceedings paper2024, IEEE 26th Electronics Packaging Technology Conference (EPTC), 2024-12-03, p.487-489Publication Optimizing Direct Die-to-Wafer Hybrid Bonding: The Role of Scanner Precorrection in Achieving fine Overlay Performance
Proceedings paper2025, IEEE International Interconnect Technology Conference (IITC), 2025-06-02